You Don’t Have to be Thermally Limited Any Longer

If you’re working on high-powered or high-density hardware, you already know this problem.

Your design isn’t limited by silicon. It’s limited by heat.

Hi, I’m Liz Chatelain, co-founder of LGDinTECH.

I work with engineering teams in RF, power, laser, dense computer, who are all hitting the thermal wall.

Let me show you a material that could change that.

Technology-grade grown diamond.

If your design is thermally limited, diamond lets you push power density without cooking your junctions.

Think of it as a heat spreader or a substrate with several times the thermal conductivity of copper, an excellent electronic insulator.

So instead of fighting heat with big heat sinks or exotic cooling system add-ons, you can pull heat right out at the device level.

That means cooler junctions at the same power.

It means more power at the same temperature or smaller, lighter hardware.

Two questions always come up when I talk about this.

Isn’t diamond too expensive?

We’re talking about technology-grade grown diamond.

This is not for jewelry.

And it’s already being used as heat spreaders and thermal substrates in real products.

Is integration risky?

You don’t have to start with a full diamond substrate.

You can begin with bonded diamond parts or a thin layer of diamond in your existing stackand then integrate more from there.

If you’re serious about solving overheating at the material level, reach out and let’sexplore how diamond fits into your next design.

You don’t have to be thermally limited any longer.

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